Issued Patents 2022
Showing 26–34 of 34 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11296051 | Semiconductor packages and forming method thereof | Chin-Fu Kao, Chih-Yuan Chien, Li-Hui Cheng | 2022-04-05 |
| 11289399 | Package structure and manufacturing method thereof | Pu Wang, Chin-Fu Kao | 2022-03-29 |
| 11289424 | Package and method of manufacturing the same | Chih-Wei Wu, Chen-Hua Yu, Kuo-Chung Yee, Ying-Ching Shih | 2022-03-29 |
| 11282793 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Jing-Cheng Lin, Chen-Hua Yu | 2022-03-22 |
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Jing-Cheng Lin, Ying-Ching Shih | 2022-03-08 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Jing-Cheng Lin, Long Hua Lee | 2022-02-22 |
| 11239136 | Adhesive and thermal interface material on a plurality of dies covered by a lid | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng, Chih-Chien Pan | 2022-02-01 |
| 11239180 | Structure and formation method of package structure with stacked semiconductor dies | Yi-Chao Mao, Chin-Chuan Chang | 2022-02-01 |
| 11239134 | Package structure and method of fabricating the same | Chih-Hao Chen, Chin-Fu Kao, Li-Hui Cheng | 2022-02-01 |