Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11239180 | Structure and formation method of package structure with stacked semiconductor dies | Chin-Chuan Chang, Szu-Wei Lu | 2022-02-01 |
YM
Yi-Chao Mao
Overall (2022): #200,595 of 548,613Top 40%
1
Patents 2022