Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515288 | Protective layer for contact pads in fan-out interconnect structure and method of forming same | Tsei-Chung Fu, Jing-Cheng Lin | 2022-11-29 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Ying-Ju Chen, Tsung-Shu Lin +5 more | 2022-10-11 |
| 11362046 | Semiconductor package | Jing-Cheng Lin, Jui-Pin Hung | 2022-06-14 |
| 11239180 | Structure and formation method of package structure with stacked semiconductor dies | Yi-Chao Mao, Szu-Wei Lu | 2022-02-01 |