Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495559 | Integrated circuits | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-11-08 |
| 11469218 | Devices employing thermal and mechanical enhanced layers and methods of forming same | Chen-Hua Yu, An-Jhih Su, Wei-Yu Chen, Tsung-Shu Lin, Chin-Chuan Chang +5 more | 2022-10-11 |
| 11362064 | Semiconductor package with shared barrier layer in redistribution and via | Hsien-Wei Chen, Ching-Jung Yang, Ming-Fa Chen, Sung-Feng Yeh | 2022-06-14 |
| 11362066 | Semiconductor structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |
| 11355468 | Structure and method of forming a joint assembly | An-Jhih Su, Hsien-Wei Chen, Der-Chyang Yeh, Chi-Hsi Wu, Chen-Hua Yu | 2022-06-07 |
| 11315855 | Package structure with photonic die and method | Hsien-Wei Chen, Ming-Fa Chen | 2022-04-26 |
| 11309291 | Die stack structure and manufacturing method thereof | Hsien-Wei Chen, Jie Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-04-19 |
| 11270989 | Semiconductor device packages, packaging methods, and packaged semiconductor devices | Jie Chen, Hsien-Wei Chen | 2022-03-08 |
| 11257775 | Mechanisms for forming post-passivation interconnect structure | Hsien-Wei Chen | 2022-02-22 |