Issued Patents 2022
Showing 1–25 of 38 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11535774 | Bitumen cutback compositions and methods of use thereof | Wallace James Rae, John Matthews, Nargess Puladian, Lijin Kuriachan | 2022-12-27 |
| 11537852 | Evolving graph convolutional networks for dynamic graphs | Aldo Pareja, Giacomo Domeniconi, Tengfei Ma, Toyotaro Suzumura, Timothy Kaler +2 more | 2022-12-27 |
| 11537530 | Non-volatile storage controller with partial logical-to-physical (L2P) address translation table | Bo Fu, Chi-Chun Lai, Dishi Lai, Jian WU, Cheng-Yun Hsu +1 more | 2022-12-27 |
| 11532567 | Electric magnetic shielding structure in packages | Chen-Hua Yu, Shin-Puu Jeng, Der-Chyang Yeh, Hsien-Wei Chen | 2022-12-20 |
| 11528039 | Error recovery using adaptive LLR lookup table | Han Zhang, Chenrong Xiong | 2022-12-13 |
| 11521700 | Reference voltage adjustment based on post-decoding and pre-decoding state information | Chenrong Xiong | 2022-12-06 |
| 11513269 | Manufacturing method of color film substrate and color film substrate | — | 2022-11-29 |
| 11508933 | Display panel and display device | Jiewei Li, Mengyu Luan | 2022-11-22 |
| 11500721 | Solid-state disk and reading and writing method thereof | Zhengtian Feng, Ke Wei, Jing Gao, Tao Wei | 2022-11-15 |
| 11488678 | Grouping flash storage blocks based on robustness for cache program operations and regular program operations | Gang Zhao, Lin Chen, Qun Zhao | 2022-11-01 |
| 11482649 | Semiconductor package and manufacturing method of semiconductor package | Ming-Fa Chen, Hsien-Wei Chen | 2022-10-25 |
| 11477451 | Methods and apparatuses for encoding and decoding video according to coding order | Yin-ji Piao, Chan-yul Kim | 2022-10-18 |
| 11468383 | Model validation of credit risk | Vijayan Nair, Agus Sudjianto, Weicheng Liu, Kevin D. Oden | 2022-10-11 |
| 11424205 | Semiconductor interconnect structure and method | Hsien-Wei Chen | 2022-08-23 |
| 11417587 | Package structure and method of fabricating the same | Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-08-16 |
| 11409665 | Partial logical-to-physical (L2P) address translation table for multiple namespaces | Bo Fu, Lin Chen, Cheng-Yun Hsu | 2022-08-09 |
| 11410948 | Semiconductor structure and manufacturing method thereof | Ming-Fa Chen, Hsien-Wei Chen | 2022-08-09 |
| 11405605 | Encoding method and device therefor, and decoding method and device therefor | Yin-ji Piao, Chan-yul Kim | 2022-08-02 |
| 11397641 | Systems and methods for ultra fast ECC with parity | Zining Wu | 2022-07-26 |
| 11393797 | Chip package with redistribution layers | Hsien-Wei Chen | 2022-07-19 |
| 11387204 | Semiconductor structure and method of fabricating the same | Hsien-Wei Chen | 2022-07-12 |
| 11386322 | System, method, and computer-program product for routing in an electronic design using deep learning | Weibin Ding, Chao Luo, Xin Zhang | 2022-07-12 |
| 11373969 | Semiconductor package and method of forming the same | Chi-Hsi Wu, Der-Chyang Yeh, Hsien-Wei Chen | 2022-06-28 |
| 11362065 | Package and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |
| 11362069 | Three-dimensional stacking structure and manufacturing method thereof | Hsien-Wei Chen, Ming-Fa Chen | 2022-06-14 |