Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502015 | Semiconductor package and manufacturing method thereof | Sung-Hui Huang, Shang-Yun Hou, Kuan-Yu Huang | 2022-11-15 |
| 11424219 | Package structure and method of fabricating the same | Sung-Hui Huang, Shang-Yun Hou | 2022-08-23 |