Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355450 | Semiconductor package with EMI shielding structure | — | 2022-06-07 |
| 11302657 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-04-12 |
| 11257780 | Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires | — | 2022-02-22 |
| 11239179 | Semiconductor package and fabrication method thereof | Chung-Che Tsai | 2022-02-01 |
| 11227846 | Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure | Chia-Hao Hsu, Tai-Yu Chen, Hsing-Chih Liu, Yao-Pang Hsu, Chi-Yuan Chen +1 more | 2022-01-18 |