Issued Patents 2022
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335553 | Bonded semiconductor structures | — | 2022-05-17 |
| 11335658 | Multi-chip package and method of formation | Chen-Hua Yu, Jui-Pin Hung, Der-Chyang Yeh | 2022-05-17 |
| 11332826 | Atomic layer deposition equipment and process method | Ta-Hao Kuo | 2022-05-17 |
| 11322380 | Substrate transfer system with tray aligner | Jung-Hua Chang | 2022-05-03 |
| 11296011 | Through-substrate vias with improved connections | Ku-Feng Yang | 2022-04-05 |
| 11282793 | Integrated fan-out structure with rugged interconnect | Shih-Ting Lin, Szu-Wei Lu, Chen-Hua Yu | 2022-03-22 |
| 11270976 | Package structure and method of manufacturing the same | Shu-Hang Liao, Chih-Wei Wu, Szu-Wei Lu, Ying-Ching Shih | 2022-03-08 |
| 11264363 | Chip package structure with seal ring structure | Chen-Hua Yu, An-Jhih Su, Po-Hao Tsai | 2022-03-01 |
| 11257715 | Integrated fan-out packages and methods of forming the same | Chih-Wei Wu, Ying-Ching Shih, Szu-Wei Lu, Long Hua Lee | 2022-02-22 |
| 11251071 | Raised via for terminal connections on different planes | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-02-15 |
| 11239138 | Methods of packaging semiconductor devices and packaged semiconductor devices | Li-Hui Cheng, Po-Hao Tsai | 2022-02-01 |