Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-12-13 |
| 11296011 | Through-substrate vias with improved connections | Jing-Cheng Lin | 2022-04-05 |