Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527439 | TSV structure and method forming same | Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-12-13 |
MC
Ming-Tsu Chung
Overall (2022): #334,186 of 548,613Top 65%
1
Patents 2022