Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527439 | TSV structure and method forming same | Ming-Tsu Chung, Ku-Feng Yang, Wen-Chih Chiou, Chen-Hua Yu | 2022-12-13 |
| 11487060 | Semiconductor device with nanostructures aligned with grating coupler and manufacturing method thereof | Yu-Kuang Liao, Jia-Xsing Li, Ping-Jung Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-11-01 |
| 11469138 | Via for coupling attached component upper electrode to substrate | Chen-Hua Yu, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh, Ming-Shih Yeh +1 more | 2022-10-11 |
| 11444020 | Via for semiconductor device connection and methods of forming the same | Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Wen-Chih Chiou, Der-Chyang Yeh +1 more | 2022-09-13 |
| 11437344 | Wafer bonding method | Yung-Chi Lin, Wen-Chih Chiou, Chen-Hua Yu | 2022-09-06 |
| 11355475 | Singulation and bonding methods and structures formed thereby | Chen-Hua Yu, Wen-Chih Chiou | 2022-06-07 |