Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502072 | Integrated circuit package and method | Chen-Hua Yu, Wen-Chih Chiou | 2022-11-15 |
| 11437344 | Wafer bonding method | Tsang-Jiuh Wu, Wen-Chih Chiou, Chen-Hua Yu | 2022-09-06 |
| 11304290 | Semiconductor structures and methods | Chen-Hua Yu, Wen-Chih Chiou | 2022-04-12 |