Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Song-Bor Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
TL
Tzy-Kuang Lee
Overall (2022): #222,869 of 548,613Top 45%
1
Patents 2022