Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450567 | Package component with stepped passivation layer | Ming-Da Cheng, Tzy-Kuang Lee, Wen-Hsiung Lu, Po-Hao Tsai, Wen-Che Chang | 2022-09-20 |
| 11233119 | Core-shell nanostructures for semiconductor devices | Cheng-Yi Peng | 2022-01-25 |
| 11233149 | Spacer structures for semiconductor devices | Cheng-Yi Peng | 2022-01-25 |