Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532596 | Package structure and method of forming the same | Hung-Yi Kuo, Cheng-Chieh Hsieh, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2022-12-20 |
| 11527490 | Packaging devices and methods of manufacture thereof | Hsien-Wei Chen, Ming-Da Cheng, Wen-Hsiung Lu | 2022-12-13 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Cheng-Chieh Hsieh +1 more | 2022-12-06 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Cheng-Chieh Hsieh, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2022-02-15 |