Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532596 | Package structure and method of forming the same | Tsung-Yuan Yu, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu | 2022-12-20 |
| 11527502 | Contact pad for semiconductor device | Chang-Chia Huang, Tsung-Shu Lin, Wei-Cheng Wu | 2022-12-13 |
| 11521959 | Die stacking structure and method forming same | Chen-Hua Yu, Hung-Yi Kuo, Chung-Shi Liu, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2022-12-06 |
| 11506843 | Semiconductor device having photonic and electronic dies and an optical fiber assembly creating an air gap | Chung-Ming Weng, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai, Hung-Yi Kuo +4 more | 2022-11-22 |
| 11410932 | Semiconductor device and method of manufacturing the same | Ming Hung Tseng, Hao-Yi Tsai | 2022-08-09 |
| 11251119 | Package structure, package-on-package structure and method of fabricating the same | Tsung-Yuan Yu, Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Hsiu-Jen Lin, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |