Issued Patents 2022
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527466 | Semiconductor device having via sidewall adhesion with encapsulant | Chen-Hua Yu, Yun Chen Hsieh, Hung-Jui Kuo | 2022-12-13 |
| 11515276 | Integrated circuit, package structure, and manufacturing method of package structure | Hung-Jui Kuo, Tai-Min Chang, Chia-Wei Wang | 2022-11-29 |
| 11515224 | Packages with enlarged through-vias in encapsulant | Hung-Jui Kuo, Tai-Min Chang, De-Yuan Lu, Ming-Tan Lee | 2022-11-29 |
| 11508633 | Package structure having taper-shaped conductive pillar and method of forming thereof | Hung-Jui Kuo, Tai-Min Chang, Chia-Wei Wang | 2022-11-22 |
| 11488908 | Semiconductor device and method | Chen-Hua Yu, Hung-Jui Kuo, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko | 2022-11-01 |
| 11450641 | Method of fabricating package structure | Hung-Jui Kuo, Chia-Wei Wang, Yu-Tzu Chang | 2022-09-20 |
| 11417604 | Dense redistribution layers in semiconductor packages and methods of forming the same | Chen-Hua Yu, Hung-Jui Kuo | 2022-08-16 |
| 11404308 | Semiconductor package and method | Hung-Jui Kuo, Yun Chen Hsieh | 2022-08-02 |
| 11378886 | Method for removing resist layer, and method of manufacturing semiconductor | Hung-Jui Kuo, Tai-Min Chang | 2022-07-05 |
| 11335579 | Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen | Chih-Yu Wang, Hung-Jui Kuo | 2022-05-17 |
| 11251121 | Package structure and method of fabricating the same | Hung-Jui Kuo, Jyun-Siang Peng | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hsiu-Jen Lin, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |
| 11232971 | Workpiece holding mechanism, process system and manufacturing method of semiconductor structure | Hung-Jui Kuo, Keng-Han Lin | 2022-01-25 |