Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Ching-Yao Lin, Teng-Yuan Lo | 2022-11-22 |
| 11407636 | Inter-poly connection for parasitic capacitor and die size improvement | Shyh-Wei Cheng, Hsi-Cheng Hsu, Ji-Hong Chiang, Jui-Chun Weng, Shiuan-Jeng Lin +2 more | 2022-08-09 |
| 11335579 | Method for manufacturing a semiconductor package and method for testing bonding strength of composite specimen | Hung-Jui Kuo, Hui-Jung Tsai | 2022-05-17 |