Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Tin-Hao Kuo, Teng-Yuan Lo, Chih-Yu Wang | 2022-11-22 |
| 11364690 | Resin-based composite structure and method for forming resin-based composite structure | Yao-Tun Chiang, Chih-Kai Chang | 2022-06-21 |
| 11292544 | Bicycle and spider capable of measuring power | Chih-Kai Chang, Chung-Wei Lin | 2022-04-05 |