Issued Patents 2022
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11538788 | Integrated fan-out stacked package with fan-out redistribution layer (RDL) | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-27 |
| 11538735 | Method of forming integrated circuit packages with mechanical braces | Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai +2 more | 2022-12-27 |
| 11532594 | Integrated fan-out package and the methods of manufacturing | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-20 |
| 11532529 | Method of manufacturing an integrated fan-out package having fan-out redistribution layer (RDL) to accommodate electrical connectors | Chen-Hua Yu, Kuo-Chung Yee, Hao-Yi Tsai | 2022-12-20 |
| 11515268 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Shih-Wei Chen | 2022-11-29 |
| 11508665 | Packages with thick RDLs and thin RDLs stacked alternatingly | Po-Yuan Teng, Kuo Lung Pan, Yu-Chia Lai, Hao-Yi Tsai, Chen-Hua Yu | 2022-11-22 |
| 11508671 | Semiconductor package and manufacturing method thereof | Po-Yuan Teng, Hao-Yi Tsai, Ching-Yao Lin, Teng-Yuan Lo, Chih-Yu Wang | 2022-11-22 |
| 11508656 | Semiconductor package and method | Kuo Lung Pan, Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang +1 more | 2022-11-22 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang +1 more | 2022-11-15 |
| 11502013 | Integrated circuit package and method | Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more | 2022-11-15 |
| 11495590 | Multi-chip semiconductor package | Yu-Chia Lai, Kuo Lung Pan, Hung-Yi Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-08 |
| 11488897 | Integrated circuit package and method | Chi-Hui Lai, Shu-Rong Chun, Kuo Lung Pan, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2022-11-01 |
| 11456249 | Package structure, package-on-package structure and manufacturing method thereof | Chuei-Tang Wang | 2022-09-27 |
| 11444002 | Package structure | Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more | 2022-09-13 |
| 11424213 | Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-08-23 |
| 11417638 | Semiconductor structures | Chi-Hui Lai, Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2022-08-16 |
| 11417633 | Integrated circuit package and method | Chen-Hua Yu, Chi-Hui Lai, Hao-Yi Tsai, Chung-Shi Liu | 2022-08-16 |
| 11404316 | System, device and methods of manufacture | Chen-Hua Yu, Wei Ling Chang, Chuei-Tang Wang, Che-Wei Hsu | 2022-08-02 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Yi-Yang Lei +2 more | 2022-06-07 |
| 11342295 | Electronic assembly, package structure having hollow cylinders and method of fabricating the same | Chen-Hua Yu, Chung-Shi Liu, Hao-Yi Tsai | 2022-05-24 |
| 11322421 | Package structure and method of forming the same | Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Kuo Lung Pan, Chun-Cheng Lin +2 more | 2022-05-03 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Sheng-Yu Wu, Yao-Chun Chuang | 2022-04-26 |
| 11315805 | Cross-wafer RDLs in constructed wafers | Chen-Hua Yu | 2022-04-26 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more | 2022-04-19 |