Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532576 | Semiconductor package and manufacturing method thereof | Sen-Kuei Hsu, Yi-Che Chiang | 2022-12-20 |
| 11508666 | Semiconductor package | Sen-Kuei Hsu, Chien-Chang Lin | 2022-11-22 |
| 11450581 | Integrated circuit package and method | Teng-Yuan Lo, Lipu Kris Chuang | 2022-09-20 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Sen-Kuei Hsu, Yi-Che Chiang | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11296067 | Package structure | Sen-Kuei Hsu, Ming-Hsien Tsai | 2022-04-05 |