Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Shih-Wei Liang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11233019 | Manufacturing method of semicondcutor package | Fang-Yu Liang, Kai-Chiang Wu | 2022-01-25 |