Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532576 | Semiconductor package and manufacturing method thereof | Sen-Kuei Hsu, Hsin-Yu Pan | 2022-12-20 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Sen-Kuei Hsu, Hsin-Yu Pan | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Sen-Kuei Hsu, Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu | 2022-06-28 |