Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532576 | Semiconductor package and manufacturing method thereof | Hsin-Yu Pan, Yi-Che Chiang | 2022-12-20 |
| 11508666 | Semiconductor package | Hsin-Yu Pan, Chien-Chang Lin | 2022-11-22 |
| 11467203 | Test circuit and method | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Chuan-Ching Wang, Hao Chen | 2022-10-11 |
| 11444023 | Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device | Hsin-Yu Pan, Yi-Che Chiang | 2022-09-13 |
| 11373922 | Semiconductor packages having thermal through vias (TTV) | Ching-Feng Yang, Hsin-Yu Pan, Kai-Chiang Wu, Yi-Che Chiang | 2022-06-28 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Yi-Yang Lei +2 more | 2022-06-07 |
| 11322453 | Semiconductor package having channels formed between through-insulator-vias | — | 2022-05-03 |
| 11296067 | Package structure | Hsin-Yu Pan, Ming-Hsien Tsai | 2022-04-05 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Mill-Jer Wang, Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, De-Jian Liu | 2022-02-15 |