Issued Patents 2022
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11467203 | Test circuit and method | Ching-Nen Peng, Hung-Chih Lin, Sen-Kuei Hsu, Chuan-Ching Wang, Hao Chen | 2022-10-11 |
| 11340291 | Testing holders for chip unit and die package | Kuo-Chuan Liu, Ching-Nen Peng, Hung-Chih Lin, Hao Chen | 2022-05-24 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Feng-Cheng Hsu, Chao-Hsiang Yang, Shin-Puu Jeng +4 more | 2022-05-17 |
| 11293974 | System and method for semiconductor device testing | Hao Chen | 2022-04-05 |
| 11249112 | Devices for high-density probing techniques and method of implementing the same | Ching-Nen Peng, Hung-Chih Lin, Wei-Hsun Lin, Sen-Kuei Hsu, De-Jian Liu | 2022-02-15 |
| 11231453 | Alignment testing for tiered semiconductor structure | Ching-Nen Peng, Hung-Chih Lin, Hao Chen, Mincent Lee | 2022-01-25 |
| 11229109 | Three dimensional integrated circuit electrostatic discharge protection and prevention test interface | Ching-Nen Peng, Hung-Chih Lin, Hao-Chiang Cheng | 2022-01-18 |