Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450579 | Integrated circuit component and package structure having the same | Tzuan-Horng Liu, Hsien-Wei Chen, Ming-Fa Chen | 2022-09-20 |
| 11335672 | Semiconductor structure and manufacturing method thereof | Hsiang-Tai Lu, Shuo-Mao Chen, Mill-Jer Wang, Feng-Cheng Hsu, Shin-Puu Jeng +4 more | 2022-05-17 |