Issued Patents 2022
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Chao-Wen Shih, Sung-Feng Yeh, Nien-Fang Wu | 2022-11-15 |
| 11456240 | Semiconductor device and method of manufacture | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2022-09-27 |
| 11450579 | Integrated circuit component and package structure having the same | Chao-Hsiang Yang, Hsien-Wei Chen, Ming-Fa Chen | 2022-09-20 |
| 11443995 | Integrated circuit package and method | Chen-Hua Yu, Sung-Feng Yeh, Ming-Fa Chen, Hsien-Wei Chen | 2022-09-13 |
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2022-08-16 |
| 11380653 | Die stack structure and manufacturing method thereof | Chen-Hua Yu, Hsien-Wei Chen, Ming-Fa Chen, Sung-Feng Yeh | 2022-07-05 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Chao-Wen Shih | 2022-05-03 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh | 2022-03-01 |
| 11233035 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Chao-Wen Shih | 2022-01-25 |