Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Chao-Wen Shih, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11244896 | Package structure and manufacturing method thereof | Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih, Shou-Zen Chang | 2022-02-08 |