Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Albert Wan, Yu-Sheng Hsieh | 2022-11-29 |
| 11502077 | Semiconductor devices having fin field effect transistor (FinFET) structures and manufacturing and design methods thereof | Tung Ying Lee, Wen-Huei Guo, Chih-Hao Chang | 2022-11-15 |
| 11488965 | SRAM device and manufacturing method thereof | Yi-Hsung Wei, Pei-Hsiu Tseng, Jia-You Lin | 2022-11-01 |
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Nan-Chin Chuang | 2022-05-17 |
| 11329056 | SRAM device and manufacturing method thereof | Yi-Hsung Wei, Jia-You Lin, Pei-Hsiu Tseng, Chih-Peng Lee, Chi-Wei Lin | 2022-05-10 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Chao-Wen Shih | 2022-02-08 |