Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Chao-Wen Shih, Shou-Zen Chang | 2022-05-17 |
| 11227854 | Semiconductor package | Chin-Yuan Lo, Chih-Hao Chang | 2022-01-18 |