Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11322474 | Semiconductor package | Chih-Hao Chang, Tze-Min Shen | 2022-05-03 |
| 11264352 | Electronic package structure with a core ground wire and chip thereof | Ting-Ying Wu, Chien-Hsiang Huang, Chih-Wei Chang | 2022-03-01 |
| 11227854 | Semiconductor package | Nan-Chin Chuang, Chih-Hao Chang | 2022-01-18 |