Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264352 | Electronic package structure with a core ground wire and chip thereof | Ting-Ying Wu, Chin-Yuan Lo, Chih-Wei Chang | 2022-03-01 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11264352 | Electronic package structure with a core ground wire and chip thereof | Ting-Ying Wu, Chin-Yuan Lo, Chih-Wei Chang | 2022-03-01 |