Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11375608 | Electromagnetic band gap structure apparatus | Hsin-Chan Hsieh, Ruey-Beei Wu, Shih-Hung Wang | 2022-06-28 |
| 11264352 | Electronic package structure with a core ground wire and chip thereof | Chien-Hsiang Huang, Chin-Yuan Lo, Chih-Wei Chang | 2022-03-01 |