Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Chao-Wen Shih, Shou-Zen Chang, Yu-Sheng Hsieh | 2022-11-29 |
| 11335655 | Package structure and manufacturing method thereof | Chao-Wen Shih, Shou-Zen Chang, Nan-Chin Chuang | 2022-05-17 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |