Issued Patents 2022
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11495573 | Package structure and manufacturing method thereof | Chen-Hua Yu, Chuei-Tang Wang | 2022-11-08 |
| 11488909 | Package structure | Chun-Wen Lin, Chen-Hua Yu, Chuei-Tang Wang, Che-Wei Hsu | 2022-11-01 |
| 11482788 | Antenna device and method for manufacturing antenna device | Chuei-Tang Wang, Jeng-Shien Hsieh, Wei-Heng Lin, Kuo-Chung Yee, Chen-Hua Yu | 2022-10-25 |
| 11460633 | Semiconductor package and manufacturing method thereof | Chih-Chieh Chang, Chen-Hua Yu, Chuei-Tang Wang | 2022-10-04 |
| 11456251 | Semiconductor structure, package structure, and manufacturing method thereof | Wei-Ting Chen, Chen-Hua Yu, Chuei-Tang Wang | 2022-09-27 |
| 11450628 | Package structure including a solenoid inductor laterally aside a die and method of fabricating the same | Tzu-Chun Tang, Chen-Hua Yu, Chuei-Tang Wang, Chia-Chia Lin | 2022-09-20 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chen-Hua Yu, Chun-Lin Lu, Han-Ping Pu, Kai-Chiang Wu | 2022-08-23 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |
| 11410923 | Semiconductor device, integrated fan-out package and method of forming the same | Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen | 2022-08-09 |
| 11380655 | Die stacks and methods forming same | Chen-Hua Yu, Chuei-Tang Wang | 2022-07-05 |
| 11362077 | Photonic semiconductor device and method | Chih-Chieh Chang, Chuei-Tang Wang, Hsing-Kuo Hsia, Chen-Hua Yu | 2022-06-14 |
| 11315891 | Methods of forming semiconductor packages having a die with an encapsulant | Chia-Chia Lin, Kai-Chiang Wu, Chuei-Tang Wang, Chen-Hua Yu | 2022-04-26 |
| 11302649 | Semiconductor device with shielding structure for cross-talk reduction | Shih-Ya Huang, Chuei-Tang Wang, Chen-Hua Yu, Chih-Yuan Chang | 2022-04-12 |
| 11282816 | Memory packages and methods of forming same | Chen-Hua Yu, Chuei-Tang Wang, Yih Wang | 2022-03-22 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 11244939 | Package structure and method of forming the same | Chen-Hua Yu, Chuei-Tang Wang, Wei-Ting Chen | 2022-02-08 |
| 11239096 | Integrated fan-out package and manufacturing method thereof | Kai-Chiang Wu, Chun-Lin Lu, Yen-Ping Wang, Che-Wei Hsu | 2022-02-01 |
| 11239157 | Package structure and package-on-package structure | Chuei-Tang Wang, Chen-Hua Yu, Wei-Ting Chen | 2022-02-01 |
| 11222883 | Package structure and method of manufacturing the same | Shih-Ya Huang, Chen-Hua Yu, Chuei-Tang Wang | 2022-01-11 |