Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11417698 | Semiconductor package and method of forming the same | Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei +3 more | 2022-05-24 |
| 11288994 | Source driver and operation method thereof | Ying-Hsiang Wang | 2022-03-29 |