Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Philip Yu-Shuan Chung, Kuei-Wei Huang, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2022-04-19 |