Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Yu-Peng Tsai +4 more | 2022-10-04 |
| 11355471 | System for processing semiconductor devices | Hsiu-Jen Lin, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |