Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532498 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-12-20 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Hsiu-Jen Lin, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |
| 11239103 | Package-on-package structure | Chih-Wei Lin, Hui-Min Huang, Yu-Peng Tsai, Ming-Da Cheng, Chung-Shi Liu | 2022-02-01 |