Issued Patents 2022
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515274 | Semiconductor package and manufacturing method thereof | Fang-Yu Liang, Kai-Chiang Wu, Chih-Chiang Tsao | 2022-11-29 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hao-Yi Tsai, Ming Hung Tseng, Tsung-Hsien Chiang, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11432372 | Warpage control in the packaging of integrated circuits | Ming-Da Cheng, Cheng-Ting Chen, Wei-Yu Chen, Chien-Wei Lee, Chung-Shi Liu | 2022-08-30 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Ching-Hua Hsieh, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang | 2022-08-16 |
| 11355471 | System for processing semiconductor devices | Kuei-Wei Huang, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2022-06-07 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hao-Jan Pei +1 more | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11244906 | Semiconductor structure and method of fabricating the same | Tzu-Sung Huang, Cheng-Chieh Hsieh, Hui-Jung Tsai, Hung-Yi Kuo, Hao-Yi Tsai +4 more | 2022-02-08 |