Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |