Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11404381 | Chip package with fan-out structure | Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
SC
Shing-Chao Chen
Overall (2022): #264,248 of 548,613Top 50%
1
Patents 2022