Issued Patents 2022
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532564 | Package structure | Yi-Da Tsai, Cheng Ping Lin, Wei-Hung Lin, Chih-Wei Lin, Ming-Da Cheng +1 more | 2022-12-20 |
| 11532551 | Semiconductor package with chamfered semiconductor device | Chung-Shi Liu, Chen-Hua Yu, Hsin-Hung Liao, Chien Ling Hwang, Sung-Yueh Wu | 2022-12-20 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11462507 | Bonding through multi-shot laser reflow | Wei-Yu Chen, Chia-Shen Cheng, Hao-Jan Pei, Philip Yu-Shuan Chung, Kuei-Wei Huang +4 more | 2022-10-04 |
| 11456226 | Semiconductor package and method of fabricating the same | Chun-Cheng Lin, Chen-Hua Yu, Chung-Shi Liu, Chih-Wei Lin | 2022-09-27 |
| 11446851 | Molding apparatus, manufacturing method of molded semiconductor device and molded semiconductor device | Sheng-Feng Weng, Chung-Shi Liu, Chih-Wei Lin, Sheng-Hsiang Chiu, Yao-Tong Lai +1 more | 2022-09-20 |
| 11417698 | Semiconductor package and method of forming the same | Chia-Lun Chang, Chung-Hao Tsai, Chung-Shi Liu, Chuei-Tang Wang, Hsiu-Jen Lin | 2022-08-16 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Tsung-Hsien Chiang, Ming-Da Cheng | 2022-08-02 |
| 11342321 | Manufacturing method of package on package structure | Hsuan-Ting Kuo, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai +3 more | 2022-05-24 |
| 11342302 | Bonding with pre-deoxide process and apparatus for performing the same | Chen-Hua Yu, Ying-Jui Huang, Chih-Hang Tung, Tung-Liang Shao, Chien Ling Hwang +2 more | 2022-05-24 |
| 11309226 | Three-dimensional integrated circuit structures and methods of forming the same | Chia-Min Lin, Chih-Wei Lin, Sheng-Hsiang Chiu, Sheng-Feng Weng, Yao-Tong Lai | 2022-04-19 |
| 11309294 | Integrated fan-out packages and methods of forming the same | Chen-Hua Yu, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin +1 more | 2022-04-19 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih, Han-Ping Pu +5 more | 2022-03-22 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |
| 11251131 | Copper contact plugs with barrier layers | Li-Lin Su, Huang-Ming Chen, Hsueh Wen Tsau | 2022-02-15 |
| 11233039 | Semiconductor packages | Sheng-Chieh Yang, Chih-Wei Lin, Yu-Hao Chen | 2022-01-25 |
| 11217555 | Aligning bumps in fan-out packaging process | Ying-Jui Huang, Chien Ling Hwang, Chih-Wei Lin, Chung-Shi Liu, Chen-Hua Yu | 2022-01-04 |