Issued Patents 2022
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527518 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Jyh Chwen Frank Lee, Yii-Chian Lu +1 more | 2022-12-13 |
| 11346860 | Probe head for high frequency signal test and medium or low frequency signal test at the same time | Chin-Tien Yang, Hui-Pin Yang, Shang-Jung Hsieh, Tsung-Yi Chen, Jhin-Ying Lyu | 2022-05-31 |
| 11233039 | Semiconductor packages | Sheng-Chieh Yang, Ching-Hua Hsieh, Chih-Wei Lin | 2022-01-25 |