Issued Patents 2022
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527518 | Heat dissipation in semiconductor packages and methods of forming same | Fong-Yuan Chang, Po-Hsiang Huang, Lee-Chung Lu, Yii-Chian Lu, Yu-Hao Chen +1 more | 2022-12-13 |