Issued Patents 2022
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11527525 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2022-12-13 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Chih-Hua Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11374136 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Chih-Hao Chang, Chia-Hung Liu, Ban-Li Wu +2 more | 2022-06-28 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2022-02-15 |