Issued Patents 2022
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11488878 | Packaging mechanisms for dies with different sizes of connectors | Chen-Shien Chen, Ching-Wen Hsiao | 2022-11-01 |
| 11482491 | Package structure with porous conductive structure and manufacturing method thereof | Wei-Yu Chen, Ching-Hua Hsieh, Hsiu-Jen Lin, Yu-Chih Huang, Yu-Peng Tsai +3 more | 2022-10-25 |
| 11342253 | Package structures and methods for forming the same | Ching-Wen Hsiao, Ming-Da Cheng, Chih-Wei Lin, Chen-Shien Chen, Chen-Cheng Kuo | 2022-05-24 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo | 2022-04-19 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Ting-Ting Kuo, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin +4 more | 2022-02-15 |