Issued Patents 2022
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11450581 | Integrated circuit package and method | Teng-Yuan Lo, Hsin-Yu Pan | 2022-09-20 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Shih-Wei Chen, Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Tin-Hao Kuo | 2022-04-19 |