Issued Patents 2022
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515268 | Semiconductor package and manufacturing method thereof | Wei-Kang Hsieh, Hao-Yi Tsai, Tin-Hao Kuo | 2022-11-29 |
| 11309302 | Manufacturing method of semiconductor package including thermal conductive block | Chih-Hua Chen, Hsin-Yu Pan, Hao-Yi Tsai, Lipu Kris Chuang, Tin-Hao Kuo | 2022-04-19 |
| 11282791 | Semiconductor device having a heat dissipation structure connected chip package | Po-Yuan Teng, Hung-Yi Kuo, Hao-Yi Tsai, Tin-Hao Kuo, Yu-Chia Lai | 2022-03-22 |
| 11239135 | Package structure and method of manufacturing the same | Hao-Yi Tsai, Kuo Lung Pan, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai | 2022-02-01 |