KP

Kuo Lung Pan

TSMC: 12 patents #163 of 3,577Top 5%
Overall (2022): #5,681 of 548,613Top 2%
12
Patents 2022

Issued Patents 2022

Showing 1–12 of 12 patents

Patent #TitleCo-InventorsDate
11538735 Method of forming integrated circuit packages with mechanical braces Shu-Rong Chun, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo +2 more 2022-12-27
11508665 Packages with thick RDLs and thin RDLs stacked alternatingly Po-Yuan Teng, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu 2022-11-22
11508656 Semiconductor package and method Shu-Rong Chun, Teng-Yuan Lo, Hung-Yi Kuo, Chih-Horng Chang, Tin-Hao Kuo +1 more 2022-11-22
11502013 Integrated circuit package and method Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang +3 more 2022-11-15
11495590 Multi-chip semiconductor package Yu-Chia Lai, Hung-Yi Kuo, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more 2022-11-08
11488897 Integrated circuit package and method Chi-Hui Lai, Shu-Rong Chun, Tin-Hao Kuo, Hao-Yi Tsai, Chung-Shi Liu +1 more 2022-11-01
11444002 Package structure Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai +4 more 2022-09-13
11424213 Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structure Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more 2022-08-23
11355466 Package structure and manufacturing method of package structure thereof Po-Yuan Teng, Hao-Yi Tsai, Sen-Kuei Hsu, Tin-Hao Kuo, Yi-Yang Lei +2 more 2022-06-07
11322421 Package structure and method of forming the same Mao-Yen Chang, Chih-Wei Lin, Hao-Yi Tsai, Chun-Cheng Lin, Tin-Hao Kuo +2 more 2022-05-03
11309294 Integrated fan-out packages and methods of forming the same Chen-Hua Yu, Tin-Hao Kuo, Hao-Yi Tsai, Hsiu-Jen Lin, Hao-Jan Pei +1 more 2022-04-19
11239135 Package structure and method of manufacturing the same Shih-Wei Chen, Hao-Yi Tsai, Tin-Hao Kuo, Po-Yuan Teng, Chi-Hui Lai 2022-02-01